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Thu, 10 Sep 2015 15:16:48 -0700 (PDT) | |
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Date: | Thu, 10 Sep 2015 22:16:48 +0000 |
Message-ID: | <CAM2RGhQvfUYe0CpjzPZxg88HQDZ07jE-WsuAjYr=Zh7nFzeO6w@mail.gmail.com> |
Subject: | Re: [geda-user] 5630 LED footprint |
From: | "Evan Foss (evanfoss AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
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On Thu, Sep 10, 2015 at 10:07 PM, DJ Delorie <dj AT delorie DOT com> wrote: > >> > Usually thermal relief is added to ease hand soldering but it will >> > also make it a very bad heat sink. I guess you have to chose >> > between either hand soldering or heat sink. >> >> Nicklas : That would defeat the point of using holes (vias really) and >> pads to heat sink the LED. > > I've done embedded pad soldering from the back with one large plated > hole. It took care to get enough heat in without toasting the chip. > IIRC I filled the hole with first flux then solder paste, so it would > be done as soon as enough heat was present. > >> What you want to do is have tons of vias and peel back the mask to >> expose more copper to remove the most heat possible. > > It's debatable whether bare (shiny) copper or soldermask can dissipate > heat better. I've heard both ways, although I'm partial to the > argument that a matte black mask would be the best emitter. I would think there would be someone who has tested this. I use a fair number of linear regulators and things that depend on PCB heatsinks. I think the data sheet for the last one suggested removing the mask. I see your point about black body emission. -- Home http://evanfoss.googlepages.com/ Work http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/
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