X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:in-reply-to:references:date:message-id:subject:from:to :content-type; bh=kByVff8k21JablJ7Dhsgh63uaQLQ6mwF/d63xuCVn3I=; b=MukNvbLfjVolBCQ/ANJKEL6vSq6dKzoJAqHSZXkpqcAXMKPHv6qzV3sCUz2NtTWwJT 246a2AkcIrh2H8aLbxfJDJN0uvvDilfKAx4WdXqwO1pqxYVDIGjvYVG+R+r7ow7JNtKT f8PGIAH4wG9HfbnNEavYaC9A2FJPyauBxN+AYuRv77tlkzZGZzkYDvR/GriPRQ1y5x6v 6WqZNIs9FrZd+QqDLyuGTvA+aOKnd0bL1S0Ylj3EeIAsuyqU2pCSSnpJ3wKGCwjDrfAq 2KS6GReNZfA6UpgfMHGIKfp55vspu+g1R3wGwQ80anm0eFyzUxavY2pYjtRs2iy01NQY HDSw== MIME-Version: 1.0 X-Received: by 10.152.22.73 with SMTP id b9mr27636575laf.83.1441923408445; Thu, 10 Sep 2015 15:16:48 -0700 (PDT) In-Reply-To: <201509102207.t8AM7GOh013740@envy.delorie.com> References: <20150910201416 DOT GG16766 AT fi DOT muni DOT cz> <20150910234211 DOT e718beb2aa1655d22382c8a6 AT gmail DOT com> <201509102207 DOT t8AM7GOh013740 AT envy DOT delorie DOT com> Date: Thu, 10 Sep 2015 22:16:48 +0000 Message-ID: Subject: Re: [geda-user] 5630 LED footprint From: "Evan Foss (evanfoss AT gmail DOT com) [via geda-user AT delorie DOT com]" To: geda-user AT delorie DOT com Content-Type: text/plain; charset=UTF-8 Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On Thu, Sep 10, 2015 at 10:07 PM, DJ Delorie wrote: > >> > Usually thermal relief is added to ease hand soldering but it will >> > also make it a very bad heat sink. I guess you have to chose >> > between either hand soldering or heat sink. >> >> Nicklas : That would defeat the point of using holes (vias really) and >> pads to heat sink the LED. > > I've done embedded pad soldering from the back with one large plated > hole. It took care to get enough heat in without toasting the chip. > IIRC I filled the hole with first flux then solder paste, so it would > be done as soon as enough heat was present. > >> What you want to do is have tons of vias and peel back the mask to >> expose more copper to remove the most heat possible. > > It's debatable whether bare (shiny) copper or soldermask can dissipate > heat better. I've heard both ways, although I'm partial to the > argument that a matte black mask would be the best emitter. I would think there would be someone who has tested this. I use a fair number of linear regulators and things that depend on PCB heatsinks. I think the data sheet for the last one suggested removing the mask. I see your point about black body emission. -- Home http://evanfoss.googlepages.com/ Work http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/