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Mail Archives: geda-user/2017/03/22/13:58:34

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Subject: Re: [geda-user] handsolder QFN packages
To: geda-user AT delorie DOT com
References: <20170322172551 DOT DF40C8106DD0 AT turkos DOT aspodata DOT se>
From: "John Griessen (john AT ecosensory DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Message-ID: <5a1aed31-73d3-0df3-f876-24551fff04d2@ecosensory.com>
Date: Wed, 22 Mar 2017 11:57:25 -0600
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On 03/22/2017 11:25 AM, karl AT aspodata DOT se wrote:
> Is it possible to handsolder QFN packages, something like [1] ?
>
> Hälsningar,
> /Karl Hammar
>
> [1] http://assets.nexperia.com/documents/data-sheet/PUSB3FR4.pdf


The Hy (width) dimension of 1.5mm makes it very hard to hold down while using an iron.
Hot air might even blow it around before it grabs due to surface tension and wetting.

IR reflow seems the only way for such small parts.


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