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	Fri, 11 Sep 2015 00:13:47 -0700 (PDT)
Date:	Fri, 11 Sep 2015 09:13:42 +0200
From:	"Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To:	geda-user AT delorie DOT com
Subject:	Re: [geda-user] 5630 LED footprint
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> On Thu, Sep 10, 2015 at 9:42 PM, Nicklas Karlsson
> (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]
> <geda-user AT delorie DOT com> wrote:
> >> In addition to that, I would like to modify the footprint for hand soldering,
> >> i.e. the middle thermal pad should have a hole in it, connected to a
> >> large pad on the opposite side of the PCB. The hole and the pad would
> >> then serve as a heat sink.
> >
> > Usually thermal relief is added to ease hand soldering but it will also make it a very bad heat sink. I guess you have to chose between either hand soldering or heat sink.
> 
> Nicklas : That would defeat the point of using holes (vias really) and
> pads to heat sink the LED.
> 
> What you want to do is have tons of vias and peel back the mask to
> expose more copper to remove the most heat possible. To solder the
> part pre-heat the board ether in an oven or with a heatgun.
> 

You are right about the heat removal.

For easy soldering thermal releif is added to reduce heat removal which of course make it worthless as a heat sink.

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