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Date:	Thu, 10 Sep 2015 21:57:22 +0000
Message-ID:	<CAM2RGhSoJTOCovSOfARhH9rWzrPvj2_kP4GVaDG6Zr-910g8mQ@mail.gmail.com>
Subject:	Re: [geda-user] 5630 LED footprint
From:	"Evan Foss (evanfoss AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
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On Thu, Sep 10, 2015 at 9:42 PM, Nicklas Karlsson
(nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]
<geda-user AT delorie DOT com> wrote:
>> In addition to that, I would like to modify the footprint for hand soldering,
>> i.e. the middle thermal pad should have a hole in it, connected to a
>> large pad on the opposite side of the PCB. The hole and the pad would
>> then serve as a heat sink.
>
> Usually thermal relief is added to ease hand soldering but it will also make it a very bad heat sink. I guess you have to chose between either hand soldering or heat sink.

Nicklas : That would defeat the point of using holes (vias really) and
pads to heat sink the LED.

What you want to do is have tons of vias and peel back the mask to
expose more copper to remove the most heat possible. To solder the
part pre-heat the board ether in an oven or with a heatgun.

-- 
Home
http://evanfoss.googlepages.com/
Work
http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/

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