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Date:	Mon, 24 Aug 2015 11:48:39 -0400
Message-ID:	<CAM2RGhRp2U4GscooZA5jdK2nY-syxOnZuhN6CGOPTXc-m49Cqw@mail.gmail.com>
Subject:	Re: [geda-user] Microphone footprint woes
From:	"Evan Foss (evanfoss AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To:	geda-user AT delorie DOT com
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On Mon, Aug 24, 2015 at 9:26 AM, Bob Paddock
(graceindustries AT gmail DOT com) [via geda-user AT delorie DOT com]
<geda-user AT delorie DOT com> wrote:
>> And I also just learned why ECMs are generally not made in SMT form
>> factor: they can't withstand the heat of reflow soldering.
>
> They also have issues with the board cleaning process, which is why we
> designed one out.

Yep they also have thermal profile issues in soldering.

> If I had to use one, I'd look at Analog Devices.
>
> http://www.akustica.com/ specializes in them.



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http://forge.abcd.harvard.edu/gf/project/epl_engineering/wiki/

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