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From:	Edward Hennessy <ehennes AT sbcglobal DOT net>
Mime-Version:	1.0 (1.0)
Subject:	Re: [geda-user] Via statements in footprints
Message-Id:	<19AD93FA-0CC9-412C-BDF7-9B4A19BB4D5B@sbcglobal.net>
Date:	Mon, 29 Dec 2014 15:24:54 -0800
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To:	"geda-user AT delorie DOT com" <geda-user AT delorie DOT com>
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Reply-To:	geda-user AT delorie DOT com

Rob,

I was looking at using a similar package on an upcoming design, and am curious on how the footprint works for you. Can you post a follow-up later?

I wanted to experiment adding vias to the layout after placing the footprint, so tenting is preserved in the soldermask on the bottom side.

Cheers,
Ed

Sent from my iPhone

> On Dec 29, 2014, at 11:48 AM, Rob Butts <r DOT butts2 AT gmail DOT com> wrote:
> 
> I'm creating a 10-vson footprint that calls for 5 vias in the big ground pad.
> 
> The statement I have is:
> 
> Via[272300 228000 2402 1200 0 1181 "" ""]
> 
> I believe the first two values are the x and y placement.  Then I would say the "2402" is the radius and the "1200" is the mask.  Is the "0" the clearance?  What is the "1181"?
> 
> Is there a nice definition like the pad?
>     #Pad[rx1 ry1 rx2 ry2 thickness clearence mask "name" "number" SFlags] 
> 
> Thanks

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