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Message-ID: | <1405875320.394.9.camel@pcjc2lap> |
Subject: | Re: [geda-user] opper ring flag for vias and pins |
From: | Peter Clifton <pcjc2 AT cam DOT ac DOT uk> |
To: | geda-user AT delorie DOT com |
Date: | Sun, 20 Jul 2014 17:55:20 +0100 |
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On Wed, 2014-07-16 at 14:22 -0400, DJ Delorie wrote: > > You need to be able to remove inner layer pad annuli completely for > > signal integrity reasons on some high-speed lines. > > Aren't there manufacturability issues if you do that? I.e. voids > where the copper should be, causing breaks in the barrel? Apparently not.. I've seen it recommended for a number of high-speed applications now. I guess the pre-preg resin fills the void? (Or if not completely - that it does enough for plating to succeed). -- Peter Clifton <peter DOT clifton AT clifton-electronics DOT co DOT uk> Clifton Electronics
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