Mail Archives: geda-user/2014/07/16/11:38:28
On 07/16/2014 03:08 AM, Peter C.J. Clifton wrote:
> On 2014-07-15 19:58, Bernd Walter wrote:
>> On Tue, Jul 15, 2014 at 10:59:07AM -0700, Dave Curtis wrote:
>>> On 07/15/2014 10:33 AM, Bernd Walter wrote:
>>> >Because I just remember this, while I wrote about holes and multilayer.
>>> >I would love to selectively switch of the copper ring per layer on
>>> >vias and pins.
>>> >The reason is that I only need to ring on solder side and on connecting
>>> >layers.
>>> >On layers I don't need the ring it just reduces space, especially
>>> >problematic with a via field e.g. inside a BGA.
>>> >It is not just routing space - the wider space between vias and pins
>>> >are preferable for groundplanes too.
>>> >
>>> So one thing I thought of that might help:
>>> Set the pad diameter on the Pin[] to the small diameter that you want on
>>> the inner layers. Larger pads cans be had on comp and solder side by
>>> drawing coincident Pad[] elements with the same pin number.
>>
>> This could work as a hack for most cases.
>> But there are oviously some drawbacks.
>
> You need to be able to remove inner layer pad annuli completely for
> signal integrity reasons on some high-speed lines.
>
How is that handled in other CAD systems? Is "no inner annuli" a part
of the footprint spec, or are they deleted after placing the part?
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