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Date: Thu, 21 Mar 2019 16:32:36 +0100
From: Kai-Martin Knaak <kmk AT familieknaak DOT de>
To: geda-user AT delorie DOT com
Subject: Re: [geda-user] Modify SMD stencil aperture size to prevent short
 circuits?
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"Richard Rasker (rasker AT linetec DOT nl) [via geda-user AT delorie DOT com]"
<geda-user AT delorie DOT com> schrieb am 21. March 2019:

> After some searching, I found that decreasing the size of the openings=20
> in the stencil and thus the amount of solder paste ending up on the
> PCB appears to be a common way to prevent shorts of this nature.
>=20
> Can anyone confirm that this is indeed a good idea?

Can confirm, this is the way to go.

> It would
> probably mean that I'd need to make two copies of each layout: one
> with the desired PCB pad sizes, and one with reduced pad (and thus
> aperture) sizes for stencil production.

The option "--paste-adjust" reduces (or increases) the size of a pad
when processed for the paste layer. Example:
	pcb -x gerber --paste-adjust -0.07mm filename.pcb
This is not very sophisticated as it treats all pads the same. However,
it this might be just what is needed. The relative size of the larger
pads are less affected.


> Any thoughts on this are appreciated!

My thought: The pcb footprint format should somehow allow setting the
mask of individual pads. (I know, whishful thinking...)

---<)kaimartin(>---

--=20
Kai-Martin Knaak
Email: kmk AT familieknaak DOT de
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