X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:in-reply-to:references:date:message-id:subject:from:to :content-type; bh=RRVPPeuijHu//wMj2mduvpHucTS9YJEujPjctQa5U3w=; b=bXPe1OL0DV6ClttZbSETER4qZzAnnqlVUBrRefoklSbL9zgXmcpyLlL8YJRaF/UtyP X80e0SkUINhEP6ngsNzmk2QIyz1LJbitGQS9SRvD9LpunNkhjcodKdTW/Z9n2lkCxkjA Y2wfZbV3djxcECgt7DwJPJFgGBSk6JsuOxiQ/rdo9glXNllee+Q0G+MvtXIL0oaaY0xx rVJa6XtCjs3+RKkd+CdDcp6Eog0ghkicC5hUujyALECdu3WspKZYeYA1nON9v3qtZ75p FzRLn6KUPFd9OAv4MSzWWt3s3TiRcwieKEm5UjcKFmMp7mDDeX9qgUYp/svgEw/ceFrI 2j0w== MIME-Version: 1.0 X-Received: by 10.52.117.174 with SMTP id kf14mr3752493vdb.26.1374172195725; Thu, 18 Jul 2013 11:29:55 -0700 (PDT) In-Reply-To: References: Date: Thu, 18 Jul 2013 14:29:55 -0400 Message-ID: Subject: Re: [geda-user] PCB BGA (ball grid array) Package/Footprint From: Rob Butts To: geda-user AT delorie DOT com Content-Type: multipart/alternative; boundary=bcaec548597496299204e1cd655e Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk --bcaec548597496299204e1cd655e Content-Type: text/plain; charset=ISO-8859-1 I'm not sure exactly what you mean here, I was thinking the pads would have a small detent the IC would settle into but apparently no such luck. It would just make it easier to line up. The people I have doing my assembly have a hard time as I imagine most people do. Thanks On Thu, Jul 18, 2013 at 12:51 PM, Bob Paddock wrote: > > The other is applying a thin layer of > > flux to the area of the BGA footprint. > > Make sure there is a clear path for water flow (cleaning fluids) for > ingress and egress of the flux. > > Makes a difference in reliability of high impedance circuits and ultra > low power circuits. > > "Make it smaller" does not always go well with "make it manufacturable" > when > hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like > bypass caps for example. :-( > --bcaec548597496299204e1cd655e Content-Type: text/html; charset=ISO-8859-1 Content-Transfer-Encoding: quoted-printable
I'm not sure exactly what you mean here,
=A0
I was thinking the pads would have a small detent the IC wo= uld settle into but apparently no such luck.=A0 It would just make it easie= r to line up.=A0 The people I have doing my assembly have a hard time as I = imagine most people do.
=A0
Thanks


On Thu, Jul 18, 2013 at 12:51 PM, Bob Paddock <graceindustries AT gmail DOT com> wrote:
> The other is applying= a thin layer of
> flux to the area of the BGA footprint.

Make sure there is a clear path for water flow (cleaning fluids) for<= br> ingress and egress of the flux.

Makes a difference in reliability of high impedance circuits and ultra
low power circuits.

"Make it smaller" does not always go well with "make it manu= facturable" when
=A0hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like
bypass caps for example. :-(

--bcaec548597496299204e1cd655e--