X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:in-reply-to:references:date:message-id:subject:from:to :content-type; bh=E7MKYokZZJdFYfIb3ff7v49GOF5aXxUnArTe5+QvD8E=; b=UyKMJiRUONqjw6o4YvfFJlD4lFBUmNbGdm1/m7QIl645x2zUgW2fzZSuZjBdfVxIIJ N9TG0qY1Cn2U9IgIjKN9K8gBPfEQS+CfH3C3dOvK4JD6xbKALAulT5FwItV2OO+h53hg bcQPAR8hIdVmN2ZeShiuZ3oZXMWxuM3i7eOsJBBJCHMURZO1IggQT4/l/6QsOF/349hh otbFLHiIYmmvZsYvwA2FyghmPMmh4QWcpuDmFyxHWgFv/btC2XjDYmwR+Vtz0DqGO/fw m1GG1Q0DZxYO8yUc6v85LqpgxrKrm+jjgaZb68SKOrWfr37rqD0aSld68Euiuf7S7Atq A0Cw== MIME-Version: 1.0 X-Received: by 10.224.67.202 with SMTP id s10mr14426914qai.66.1374166272345; Thu, 18 Jul 2013 09:51:12 -0700 (PDT) In-Reply-To: References: Date: Thu, 18 Jul 2013 12:51:12 -0400 Message-ID: Subject: Re: [geda-user] PCB BGA (ball grid array) Package/Footprint From: Bob Paddock To: geda-user AT delorie DOT com Content-Type: text/plain; charset=ISO-8859-1 Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk > The other is applying a thin layer of > flux to the area of the BGA footprint. Make sure there is a clear path for water flow (cleaning fluids) for ingress and egress of the flux. Makes a difference in reliability of high impedance circuits and ultra low power circuits. "Make it smaller" does not always go well with "make it manufacturable" when hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like bypass caps for example. :-(