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Date: Thu, 18 Jul 2013 10:14:45 -0400
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Subject: Re: [geda-user] PCB BGA (ball grid array) Package/Footprint
From: Bob Paddock <graceindustries AT gmail DOT com>
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On Thu, Jul 18, 2013 at 9:19 AM, Rob Butts <r DOT butts2 AT gmail DOT com> wrote:
> Has anyone done a PCB using the new chips with the BGA (ball grid array)?
> If so, how did you define the footprint?  As through-holes?

You can download a free copy of "BGA Breakout and Routing" in .PDF from here:

http://iconnect007.com/ads/mentor/book.php

> Fab shops must
> be capable of accommodating these ICs otherwise they wouldn't exist.

Depends on the shop and the number of balls.  Only High End shops deal
in High Density Interconnect (HDI).

> I'm thinking they must be easy to solder since it would simply fall into
> it's position with either pre-soldered holes or pre-soldered pins/balls.

Depends on the type of solder too.  Lead based solder has better
'flow' to get things to where they should be.
Lead Free does not flow as well.

Some places do not like holes/vias in pads for BGA's, other don't
care, check with your Fab Shop.

I'd rather deal with BGA's that LCC's/LGA's and their ilk.