| www.delorie.com/archives/browse.cgi | search |
| X-Authentication-Warning: | delorie.com: mail set sender to geda-user-bounces using -f |
| X-Recipient: | geda-user AT delorie DOT com |
| X-Original-DKIM-Signature: | v=1; a=rsa-sha256; c=relaxed/relaxed; |
| d=gmail.com; s=20161025; | |
| h=mime-version:in-reply-to:references:from:date:message-id:subject:to; | |
| bh=AERTqslmHjekjwO2STDl69tvNW56K+pL+5WVKR4ktXs=; | |
| b=jt25fwEGS+iba85LyLlw0URSS/3jv+X2Shtz14hSvlZu6a++F64MnxNLZSj3yQrVlk | |
| q2P/QETOxV2pEg6zOY7KeQ6uWY+/1sfI44MRHtJLlC7R+eUjAVUgMhTomQIkuQFqDncz | |
| zI4bnPkAhDSNmqXuuvchDZj2FxLQ7r1bS66eldKO00qeXuPMmXgh6Qge74jxk19a+nAC | |
| URXiJnqJyNysx6pGx0Zpcio3RK7YSVx+5WLmuUG6qbxk6DcClQW0w2QbuiJ1gYjNcbGd | |
| zEfsfyE5SSv6bl3++cTUfwpM9S8dQif624zUM9vDp14BG4gfgsaCBb/KB9PA/6HeuSEI | |
| 45EA== | |
| X-Google-DKIM-Signature: | v=1; a=rsa-sha256; c=relaxed/relaxed; |
| d=1e100.net; s=20161025; | |
| h=x-gm-message-state:mime-version:in-reply-to:references:from:date | |
| :message-id:subject:to; | |
| bh=AERTqslmHjekjwO2STDl69tvNW56K+pL+5WVKR4ktXs=; | |
| b=IR7nC3k6KNKSbS0heNpcn2LtOX4ZzOwYqzYQlEJ9M5sSzgKON8PPCWJ4S1kKjfQZB2 | |
| KtMPQzvJ+XLcSyeOEQFUiVlBQQeAWPZH6qujR2x7Yj0cpBO2as6KvjsVpMi1+ppy81J3 | |
| +z1d+rnsZMyPxojsKq8RcaFOW32s+zWGPPDmLDOtA3iVZrgyBHcqP85Pl50c9bug/Uz3 | |
| GrXmT0u7zyRsZVbMOvronaLQB+GrfaLc/jlN/fDrUWtrr/OhLEf7eAMY3YG2GwL8RvVJ | |
| FOLo+GhiayGQkVnjb06hc8knacEm/OhR0Hur2sZBwFrW1vF3Y7PlqbsG2GcS6FSubuhr | |
| A92Q== | |
| X-Gm-Message-State: | AFeK/H0PaVyANw1K47069oo2uYZgNTzkg4MEYXv9bVhFR3K/BU9oEexTaBPuulBjhUo7v76AqHlNgrhoWTjO/Q== |
| X-Received: | by 10.31.136.136 with SMTP id k130mr1253423vkd.60.1490971235955; |
| Fri, 31 Mar 2017 07:40:35 -0700 (PDT) | |
| MIME-Version: | 1.0 |
| In-Reply-To: | <CA+qhd=-+AM_zsdJXCCzcH8X74LfA=tr1OsksasbTkBdc-v1Z=w@mail.gmail.com> |
| References: | <20170327154129 DOT 68029809DB6C AT turkos DOT aspodata DOT se> |
| <CA+qhd=_Gi=-wrWOKJSrVq3stF5uCLpfur8KcW3FnLrn7=vF+4w AT mail DOT gmail DOT com> | |
| <20170328132437 DOT 46A6B809DB6C AT turkos DOT aspodata DOT se> <CA+qhd=-tZ7cxoB4Db_Bkx47U15OoWUAkiHAW_Xo7aWX8GYfTRQ AT mail DOT gmail DOT com> | |
| <CAC4O8c_c76o0A7RFvZuKOnS9JidWR5fz+CVKYFBO307AA1PF8g AT mail DOT gmail DOT com> | |
| <CA+qhd=_5PGzXEr-KvKKCRZtgtd0oFvD-=6AjD=D=0_tf93VV+Q AT mail DOT gmail DOT com> | |
| <20170329182946 DOT ae2033e7ec476c9f1ddd35f3 AT gmail DOT com> <CA+qhd=_y_waDfNMpmROtd7X6E1Rn-BYcYiD7SHkePNwhCKTXZg AT mail DOT gmail DOT com> | |
| <20170330182655 DOT 91a8f3e1f328bd0becb1ca3f AT gmail DOT com> <CA+qhd=-+AM_zsdJXCCzcH8X74LfA=tr1OsksasbTkBdc-v1Z=w AT mail DOT gmail DOT com> | |
| From: | "Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
| Date: | Fri, 31 Mar 2017 16:40:35 +0200 |
| Message-ID: | <CADL2oCVwg7sA+LpS7oDm=6faq2QEyS6Zw5tUhn4Wa8bj8ozmhg@mail.gmail.com> |
| Subject: | Re: [geda-user] No support for solder paste in pcb file format ? |
| To: | geda-user AT delorie DOT com |
| Reply-To: | geda-user AT delorie DOT com |
| Errors-To: | nobody AT delorie DOT com |
| X-Mailing-List: | geda-user AT delorie DOT com |
| X-Unsubscribes-To: | listserv AT delorie DOT com |
--001a1145955ae3b9ec054c07ca03 Content-Type: text/plain; charset=UTF-8 I used other software before and there it was possible to draw in paste layer but I also heard files where modified before production. It is more a question about if paste layer is bettery generated from a template like clearance is around objects or by manually adding objects to the layer? 2017-03-31 1:50 GMT+02:00 John Luciani (jluciani AT gmail DOT com) [via geda-user AT delorie DOT com] <geda-user AT delorie DOT com>: > > > On Thu, Mar 30, 2017 at 12:26 PM, Nicklas Karlsson ( > nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] < > geda-user AT delorie DOT com> wrote: > >> > > > > >> John Luciani: >> > > > > >> > I create stencil footprints with the same basename as >> > > > > >> > the component footprint and a ".sfp" extension. I have >> > > > > >> > a script that parses the pcb and identifies all components >> > > > > >> > that have a stencil footprint. >> > > > > >> > > > > I couldn't find this script on your page. Could you please post >> or >> > > link? >> > > > > >> > > > >> > > > The script isn't quite ready for prime-time. >> > > >> > > But you tell why these scipts are good? >> > > >> > > >> > The current script identifies the footprints that should be changed when >> > generating gerbers for a stencil. The completed script will perform the >> > replacement. >> >> To put it another way. Is it better to generate paste layer from a script >> than manually editing each footprint? >> > > I do not manually edit anything. If a part requires a stencil footprint it > is generated with a script along with the footprint. > > For the other parts I do not bother. Future versions of the script will > accommodate parts > without sfp files by generating slightly reduced stencil openings for each > pad. > > >> >> > > > > >> as thin line silk for checking or write the pads to the sfp >> file. >> > > > > >> >> > > > > >> Do you have any specific file format for your sfp files ? >> > > > > >> >> > > > > > >> > > > > > I just make them as normal footprints. For example - the stencil >> > > > > footprint >> > > > > > below is for a Cree XP-G LED -- >> > > > > > >> > > > > > Element[0x0 "LED" "" "" 0 0 9996 2996 0 100 0x0] >> > > > > > ( >> > > > > > Pad[-5511 -5511 -5511 5511 1968 2000 2968 "" "1" 0x0100] >> > > > > > Pad[5511 -5511 5511 5511 1968 2000 2968 "" "2" 0x0100] >> > > > > > Pad[-492 -3937 492 -3937 2952 2000 3952 "" "3" 0x0100] >> > > > > > Pad[-492 0 492 0 2952 2000 3952 "" "3" 0x0100] >> > > > > > Pad[-492 3937 492 3937 2952 2000 3952 "" "3" 0x0100] >> > > > > > ElementLine[7996 -2484 7996 -7996 1000] >> > > > > > ElementLine[7996 -7996 -7996 -7996 1000] >> > > > > > ElementLine[-7996 -7996 -7996 -2484 1000] >> > > > > > ElementLine[7996 2484 7996 7996 1000] >> > > > > > ElementLine[7996 7996 -7996 7996 1000] >> > > > > > ElementLine[-7996 7996 -7996 2484 1000] >> > > > > > ElementArc[-7996 -10496 500 500 0 360 1000] >> > > > > > ) >> > > >> > > The *.sfp files are used to define shapes for solder paste? >> > > >> > >> > The shapes define openings in a stencil. >> >> Then the shapes end up on the "stencil" layer, I think "paste" layer is a >> common name for this layer. >> >> >> > > > For thermal pads I always use the grid. I have seen a lot of >> production >> > > > problems. Bridging and misalignments. On these large pads I use a >> grid >> > > > which reduces the coverage to between 50 - 60%. >> > > >> > > You use a grid because there will be production problems for a solid >> shape? >> > > >> > >> > Yes. I have seen bridging and misalignments. All of the components that >> > I have used (with thermal pads) have recommended stencil openings >> > as well as footprints. I either follow the datasheet recommendation or >> > the manufacturer application notes. >> >> I do not perfectly understand this, do you have an example for example >> datasheet or application note? >> > > > The datasheet for the Cree XPG is at > > www.cree.com/led-components/media/documents/XLampXPG-15B.pdf > > Near the end of the file are the footprint and stencil > recommendations. > > > >> >> >> Regards Nicklas Karlsson >> > > > > -- > http://www.wiblocks.com > --001a1145955ae3b9ec054c07ca03 Content-Type: text/html; charset=UTF-8 Content-Transfer-Encoding: quoted-printable <div dir=3D"ltr">I used other software before and there it was possible to = draw in paste layer but I also heard files where modified before production= . It is more a question about if paste layer is bettery generated from a te= mplate like clearance is around objects or by manually adding objects to th= e layer?</div><div class=3D"gmail_extra"><br><div class=3D"gmail_quote">201= 7-03-31 1:50 GMT+02:00 John Luciani (<a href=3D"mailto:jluciani AT gmail DOT com">= jluciani AT gmail DOT com</a>) [via <a href=3D"mailto:geda-user AT delorie DOT com">geda-= user AT delorie DOT com</a>] <span dir=3D"ltr"><<a href=3D"mailto:geda-user AT del= orie.com" target=3D"_blank">geda-user AT delorie DOT com</a>></span>:<br><block= quote class=3D"gmail_quote" style=3D"margin:0 0 0 .8ex;border-left:1px #ccc= solid;padding-left:1ex"><div dir=3D"ltr"><br><div class=3D"gmail_extra"><b= r><div class=3D"gmail_quote"><span class=3D"">On Thu, Mar 30, 2017 at 12:26= PM, Nicklas Karlsson (<a href=3D"mailto:nicklas DOT karlsson17 AT gmail DOT com" targ= et=3D"_blank">nicklas DOT karlsson17 AT gmail DOT com</a>) [via <a href=3D"mailto:geda= -user AT delorie DOT com" target=3D"_blank">geda-user AT delorie DOT com</a>] <span dir= =3D"ltr"><<a href=3D"mailto:geda-user AT delorie DOT com" target=3D"_blank">ged= a-user AT delorie DOT com</a>></span> wrote:<br><blockquote class=3D"gmail_quot= e" style=3D"margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204)= ;padding-left:1ex"><span class=3D"m_-3346816896407057893gmail-">> > &= gt; > >> John Luciani:<br> > > > > >> > I create stencil footprints with the same= basename as<br> > > > > >> > the component footprint and a ".sfp&= quot; extension. I have<br> > > > > >> > a script that parses the pcb and identifi= es all components<br> > > > > >> > that have a stencil footprint.<br> > > > ><br> > > > > I couldn't find this script on your page.=C2=A0 Cou= ld you please post or<br> > > link?<br> > > > ><br> > > ><br> > > > The script isn't quite ready for prime-time.<br> > ><br> > > But you tell why these scipts are good?<br> > ><br> > ><br> > The current script identifies the footprints that should be changed wh= en<br> > generating gerbers for a stencil. The completed script will perform th= e<br> > replacement.<br> <br> </span>To put it another way. Is it better to generate paste layer from a s= cript than manually editing each footprint?<br></blockquote><div><br></div>= </span><div>I do not manually edit anything. If a part requires a stencil f= ootprint it<br></div><div>is generated with a script along with the footpri= nt.<br><br></div><div>For the other parts I do not bother. Future versions = of the script will accommodate parts<br>without sfp files by generating sli= ghtly reduced stencil openings for each pad. <br><br></div><div><div class= =3D"h5"><blockquote class=3D"gmail_quote" style=3D"margin:0px 0px 0px 0.8ex= ;border-left:1px solid rgb(204,204,204);padding-left:1ex"> <span class=3D"m_-3346816896407057893gmail-"><br> <br> > > > > >> as thin line silk for checking or write the pa= ds to the sfp file.<br> > > > > >><br> > > > > >> Do you have any specific file format for your = sfp files ?<br> > > > > >><br> > > > > ><br> > > > > > I just make them as normal footprints. For example= - the stencil<br> > > > > footprint<br> > > > > > below is for a Cree XP-G LED --<br> > > > > ><br> > > > > > Element[0x0 "LED" "" "&qu= ot; 0 0 9996 2996 0 100 0x0]<br> > > > > > (<br> > > > > >=C2=A0 =C2=A0 Pad[-5511 -5511 -5511 5511 1968 2000 = 2968 "" "1" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[5511 -5511 5511 5511 1968 2000 29= 68 "" "2" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[-492 -3937 492 -3937 2952 2000 39= 52 "" "3" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[-492 0 492 0 2952 2000 3952 "= ;" "3" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[-492 3937 492 3937 2952 2000 3952= "" "3" 0x0100]<br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 -2484 7996 -7996 100= 0]<br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 -7996 -7996 -7996 10= 00]<br> > > > > >=C2=A0 =C2=A0 ElementLine[-7996 -7996 -7996 -2484 1= 000]<br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 2484 7996 7996 1000]= <br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 7996 -7996 7996 1000= ]<br> > > > > >=C2=A0 =C2=A0 ElementLine[-7996 7996 -7996 2484 100= 0]<br> > > > > >=C2=A0 =C2=A0 ElementArc[-7996 -10496 500 500 0 360= 1000]<br> > > > > > )<br> > ><br> > > The *.sfp files are used to define shapes for solder paste?<br> > ><br> ><br> > The shapes define openings in a stencil.<br> <br> </span>Then the shapes end up on the "stencil" layer, I think &qu= ot;paste" layer is a common name for this layer.<br> <span class=3D"m_-3346816896407057893gmail-"><br> <br> > > > For thermal pads I always use the grid. I have seen a lot of= production<br> > > > problems. Bridging and misalignments. On these large pads I = use a grid<br> > > > which reduces the coverage to between 50 - 60%.<br> > ><br> > > You use a grid because there will be production problems for a so= lid shape?<br> > ><br> ><br> > Yes. I have seen bridging and misalignments. All of the components tha= t<br> > I have used (with thermal pads) have recommended stencil openings<br> > as well as footprints. I either follow the datasheet recommendation or= <br> > the manufacturer application notes.<br> <br> </span>I do not perfectly understand this, do you have an example for examp= le datasheet or application note?<br></blockquote><div><br><br></div></div>= </div><div>The datasheet for the Cree XPG is at <br><br><cite class=3D"m_-3= 346816896407057893gmail-_Rm"><a href=3D"http://www.cree.com/led-components/= media/documents/XLampXPG-15B.pdf" target=3D"_blank">www.cree.com/led-compon= ents/<wbr>media/documents/XLampXPG-15B.<wbr>pdf</a><br><br></cite></div><di= v><cite class=3D"m_-3346816896407057893gmail-_Rm">Near the end of the file = are the footprint and stencil </cite><br><cite class=3D"m_-3346816896407057= 893gmail-_Rm">recommendations. </cite></div><div><br>=C2=A0</div><blockquot= e class=3D"gmail_quote" style=3D"margin:0px 0px 0px 0.8ex;border-left:1px s= olid rgb(204,204,204);padding-left:1ex"> <br> <br> Regards Nicklas Karlsson<span class=3D"HOEnZb"><font color=3D"#888888"><br> </font></span></blockquote></div><span class=3D"HOEnZb"><font color=3D"#888= 888"><br><br clear=3D"all"><br>-- <br><div class=3D"m_-3346816896407057893g= mail_signature"><a href=3D"http://www.wiblocks.com" target=3D"_blank">http:= //www.wiblocks.com</a> =C2=A0</div> </font></span></div></div> </blockquote></div><br></div> --001a1145955ae3b9ec054c07ca03--
| webmaster | delorie software privacy |
| Copyright © 2019 by DJ Delorie | Updated Jul 2019 |