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| From: | "John Luciani (jluciani AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
| Date: | Thu, 30 Mar 2017 19:50:23 -0400 |
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| Subject: | Re: [geda-user] No support for solder paste in pcb file format ? |
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--94eb2c1ce7a0481468054bfb5b9a Content-Type: text/plain; charset=UTF-8 On Thu, Mar 30, 2017 at 12:26 PM, Nicklas Karlsson ( nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] < geda-user AT delorie DOT com> wrote: > > > > > >> John Luciani: > > > > > >> > I create stencil footprints with the same basename as > > > > > >> > the component footprint and a ".sfp" extension. I have > > > > > >> > a script that parses the pcb and identifies all components > > > > > >> > that have a stencil footprint. > > > > > > > > > > I couldn't find this script on your page. Could you please post or > > > link? > > > > > > > > > > > > > The script isn't quite ready for prime-time. > > > > > > But you tell why these scipts are good? > > > > > > > > The current script identifies the footprints that should be changed when > > generating gerbers for a stencil. The completed script will perform the > > replacement. > > To put it another way. Is it better to generate paste layer from a script > than manually editing each footprint? > I do not manually edit anything. If a part requires a stencil footprint it is generated with a script along with the footprint. For the other parts I do not bother. Future versions of the script will accommodate parts without sfp files by generating slightly reduced stencil openings for each pad. > > > > > > >> as thin line silk for checking or write the pads to the sfp > file. > > > > > >> > > > > > >> Do you have any specific file format for your sfp files ? > > > > > >> > > > > > > > > > > > > I just make them as normal footprints. For example - the stencil > > > > > footprint > > > > > > below is for a Cree XP-G LED -- > > > > > > > > > > > > Element[0x0 "LED" "" "" 0 0 9996 2996 0 100 0x0] > > > > > > ( > > > > > > Pad[-5511 -5511 -5511 5511 1968 2000 2968 "" "1" 0x0100] > > > > > > Pad[5511 -5511 5511 5511 1968 2000 2968 "" "2" 0x0100] > > > > > > Pad[-492 -3937 492 -3937 2952 2000 3952 "" "3" 0x0100] > > > > > > Pad[-492 0 492 0 2952 2000 3952 "" "3" 0x0100] > > > > > > Pad[-492 3937 492 3937 2952 2000 3952 "" "3" 0x0100] > > > > > > ElementLine[7996 -2484 7996 -7996 1000] > > > > > > ElementLine[7996 -7996 -7996 -7996 1000] > > > > > > ElementLine[-7996 -7996 -7996 -2484 1000] > > > > > > ElementLine[7996 2484 7996 7996 1000] > > > > > > ElementLine[7996 7996 -7996 7996 1000] > > > > > > ElementLine[-7996 7996 -7996 2484 1000] > > > > > > ElementArc[-7996 -10496 500 500 0 360 1000] > > > > > > ) > > > > > > The *.sfp files are used to define shapes for solder paste? > > > > > > > The shapes define openings in a stencil. > > Then the shapes end up on the "stencil" layer, I think "paste" layer is a > common name for this layer. > > > > > > For thermal pads I always use the grid. I have seen a lot of > production > > > > problems. Bridging and misalignments. On these large pads I use a > grid > > > > which reduces the coverage to between 50 - 60%. > > > > > > You use a grid because there will be production problems for a solid > shape? > > > > > > > Yes. I have seen bridging and misalignments. All of the components that > > I have used (with thermal pads) have recommended stencil openings > > as well as footprints. I either follow the datasheet recommendation or > > the manufacturer application notes. > > I do not perfectly understand this, do you have an example for example > datasheet or application note? > The datasheet for the Cree XPG is at www.cree.com/led-components/media/documents/XLampXPG-15B.pdf Near the end of the file are the footprint and stencil recommendations. > > > Regards Nicklas Karlsson > -- http://www.wiblocks.com --94eb2c1ce7a0481468054bfb5b9a Content-Type: text/html; charset=UTF-8 Content-Transfer-Encoding: quoted-printable <div dir=3D"ltr"><br><div class=3D"gmail_extra"><br><div class=3D"gmail_quo= te">On Thu, Mar 30, 2017 at 12:26 PM, Nicklas Karlsson (<a href=3D"mailto:n= icklas DOT karlsson17 AT gmail DOT com">nicklas DOT karlsson17 AT gmail DOT com</a>) [via <a href= =3D"mailto:geda-user AT delorie DOT com">geda-user AT delorie DOT com</a>] <span dir=3D"l= tr"><<a href=3D"mailto:geda-user AT delorie DOT com" target=3D"_blank">geda-use= r AT delorie DOT com</a>></span> wrote:<br><blockquote class=3D"gmail_quote" st= yle=3D"margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padd= ing-left:1ex"><span class=3D"gmail-">> > > > >> John Luci= ani:<br> > > > > >> > I create stencil footprints with the same= basename as<br> > > > > >> > the component footprint and a ".sfp&= quot; extension. I have<br> > > > > >> > a script that parses the pcb and identifi= es all components<br> > > > > >> > that have a stencil footprint.<br> > > > ><br> > > > > I couldn't find this script on your page.=C2=A0 Cou= ld you please post or<br> > > link?<br> > > > ><br> > > ><br> > > > The script isn't quite ready for prime-time.<br> > ><br> > > But you tell why these scipts are good?<br> > ><br> > ><br> > The current script identifies the footprints that should be changed wh= en<br> > generating gerbers for a stencil. The completed script will perform th= e<br> > replacement.<br> <br> </span>To put it another way. Is it better to generate paste layer from a s= cript than manually editing each footprint?<br></blockquote><div><br></div>= <div>I do not manually edit anything. If a part requires a stencil footprin= t it<br></div><div>is generated with a script along with the footprint.<br>= <br></div><div>For the other parts I do not bother. Future versions of the = script will accommodate parts<br>without sfp files by generating slightly r= educed stencil openings for each pad. <br><br></div><blockquote class=3D"gm= ail_quote" style=3D"margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,= 204,204);padding-left:1ex"> <span class=3D"gmail-"><br> <br> > > > > >> as thin line silk for checking or write the pa= ds to the sfp file.<br> > > > > >><br> > > > > >> Do you have any specific file format for your = sfp files ?<br> > > > > >><br> > > > > ><br> > > > > > I just make them as normal footprints. For example= - the stencil<br> > > > > footprint<br> > > > > > below is for a Cree XP-G LED --<br> > > > > ><br> > > > > > Element[0x0 "LED" "" "&qu= ot; 0 0 9996 2996 0 100 0x0]<br> > > > > > (<br> > > > > >=C2=A0 =C2=A0 Pad[-5511 -5511 -5511 5511 1968 2000 = 2968 "" "1" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[5511 -5511 5511 5511 1968 2000 29= 68 "" "2" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[-492 -3937 492 -3937 2952 2000 39= 52 "" "3" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[-492 0 492 0 2952 2000 3952 "= ;" "3" 0x0100]<br> > > > > >=C2=A0 =C2=A0 Pad[-492 3937 492 3937 2952 2000 3952= "" "3" 0x0100]<br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 -2484 7996 -7996 100= 0]<br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 -7996 -7996 -7996 10= 00]<br> > > > > >=C2=A0 =C2=A0 ElementLine[-7996 -7996 -7996 -2484 1= 000]<br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 2484 7996 7996 1000]= <br> > > > > >=C2=A0 =C2=A0 ElementLine[7996 7996 -7996 7996 1000= ]<br> > > > > >=C2=A0 =C2=A0 ElementLine[-7996 7996 -7996 2484 100= 0]<br> > > > > >=C2=A0 =C2=A0 ElementArc[-7996 -10496 500 500 0 360= 1000]<br> > > > > > )<br> > ><br> > > The *.sfp files are used to define shapes for solder paste?<br> > ><br> ><br> > The shapes define openings in a stencil.<br> <br> </span>Then the shapes end up on the "stencil" layer, I think &qu= ot;paste" layer is a common name for this layer.<br> <span class=3D"gmail-"><br> <br> > > > For thermal pads I always use the grid. I have seen a lot of= production<br> > > > problems. Bridging and misalignments. On these large pads I = use a grid<br> > > > which reduces the coverage to between 50 - 60%.<br> > ><br> > > You use a grid because there will be production problems for a so= lid shape?<br> > ><br> ><br> > Yes. I have seen bridging and misalignments. All of the components tha= t<br> > I have used (with thermal pads) have recommended stencil openings<br> > as well as footprints. I either follow the datasheet recommendation or= <br> > the manufacturer application notes.<br> <br> </span>I do not perfectly understand this, do you have an example for examp= le datasheet or application note?<br></blockquote><div><br><br></div><div>T= he datasheet for the Cree XPG is at <br><br><cite class=3D"gmail-_Rm"><a hr= ef=3D"http://www.cree.com/led-components/media/documents/XLampXPG-15B.pdf">= www.cree.com/led-components/media/documents/XLampXPG-15B.pdf</a><br><br></c= ite></div><div><cite class=3D"gmail-_Rm">Near the end of the file are the f= ootprint and stencil </cite><br><cite class=3D"gmail-_Rm">recommendations. = </cite></div><div><br>=C2=A0</div><blockquote class=3D"gmail_quote" style= =3D"margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding= -left:1ex"> <br> <br> Regards Nicklas Karlsson<br> </blockquote></div><br><br clear=3D"all"><br>-- <br><div class=3D"gmail_sig= nature"><a href=3D"http://www.wiblocks.com" target=3D"_blank">http://www.wi= blocks.com</a> =C2=A0</div> </div></div> --94eb2c1ce7a0481468054bfb5b9a--
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