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	Wed, 29 Mar 2017 09:29:47 -0700 (PDT)
Date:	Wed, 29 Mar 2017 18:29:46 +0200
From:	"Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To:	geda-user AT delorie DOT com
Subject:	Re: [geda-user] No support for solder paste in pcb file format ?
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> > >> John Luciani:
> > >> > I create stencil footprints with the same basename as
> > >> > the component footprint and a ".sfp" extension. I have
> > >> > a script that parses the pcb and identifies all components
> > >> > that have a stencil footprint.
> >
> > I couldn't find this script on your page.  Could you please post or link?
> >
> 
> The script isn't quite ready for prime-time.

But you tell why these scipts are good?


> > >> Then I could have a flag in the fp generator to either make paste pads
> > >> as thin line silk for checking or write the pads to the sfp file.
> > >>
> > >> Do you have any specific file format for your sfp files ?
> > >>
> > >
> > > I just make them as normal footprints. For example - the stencil
> > footprint
> > > below is for a Cree XP-G LED --
> > >
> > > Element[0x0 "LED" "" "" 0 0 9996 2996 0 100 0x0]
> > > (
> > >    Pad[-5511 -5511 -5511 5511 1968 2000 2968 "" "1" 0x0100]
> > >    Pad[5511 -5511 5511 5511 1968 2000 2968 "" "2" 0x0100]
> > >    Pad[-492 -3937 492 -3937 2952 2000 3952 "" "3" 0x0100]
> > >    Pad[-492 0 492 0 2952 2000 3952 "" "3" 0x0100]
> > >    Pad[-492 3937 492 3937 2952 2000 3952 "" "3" 0x0100]
> > >    ElementLine[7996 -2484 7996 -7996 1000]
> > >    ElementLine[7996 -7996 -7996 -7996 1000]
> > >    ElementLine[-7996 -7996 -7996 -2484 1000]
> > >    ElementLine[7996 2484 7996 7996 1000]
> > >    ElementLine[7996 7996 -7996 7996 1000]
> > >    ElementLine[-7996 7996 -7996 2484 1000]
> > >    ElementArc[-7996 -10496 500 500 0 360 1000]
> > > )

The *.sfp files are used to define shapes for solder paste?


> For thermal pads I always use the grid. I have seen a lot of production
> problems. Bridging and misalignments. On these large pads I use a grid
> which reduces the coverage to between 50 - 60%.

You use a grid because there will be production problems for a solid shape?

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