X-Authentication-Warning:	delorie.com: mail set sender to geda-user-bounces using -f
X-Recipient:	geda-user AT delorie DOT com
X-Google-DKIM-Signature:	v=1; a=rsa-sha256; c=relaxed/relaxed;
	d=1e100.net; s=20130820;
	h=x-gm-message-state:mime-version:in-reply-to:references:date
	:message-id:subject:from:to:content-type;
	bh=XQFGdaHGFELBv6unFUuS/mzKab59RfMFMZpBUqY921U=;
	b=BPajyF9Ts00xOgj2B4uLS2UffCbSMRK715d/DA6cHYC1q1mWDwqFQyuhpgTLxcAgjN
	DLHTlsuqRDfuwTSBqOYkqg7a7YtjjXcdc6Vyt9Le/Ftw1dxrjhUNyoH+isxK9ePZRaZG
	A8kHil+bSVronNjJzaSt6w5vqLWaSmS71UtF+9vRWAb9nYFVjljnxHF62GYOQNUjf+4f
	RMXCnUhPq1+z9DCAIlYYljEnYcnHnA24AdGkTR44xL0gq02AQQ4Fw3h6lrmjelj+uVE1
	idaruoCs6sRLhwu9xLiGV9fvxRy7RwjnmFmO5Lo8cdGff1uhjGd3b3tHXZKi0ms05He+
	HaBg==
X-Gm-Message-State:	ALoCoQnA+QHOMWUP3L8T3FwN+monDHU21QcTZXOGs6sL6umwdXgBBwY+Qq6qW1mq2wL6qLAgwnt+
MIME-Version:	1.0
X-Received:	by 10.180.85.133 with SMTP id h5mr8916227wiz.1.1377549194447; Mon,
	26 Aug 2013 13:33:14 -0700 (PDT)
In-Reply-To:	<CAC4O8c9Zzc4OGqGn-zc0T-KdYkXch+fwQjyuuEF=P_ZQtjLmnw@mail.gmail.com>
References:	<CAC4O8c9Zzc4OGqGn-zc0T-KdYkXch+fwQjyuuEF=P_ZQtjLmnw AT mail DOT gmail DOT com>
Date:	Mon, 26 Aug 2013 13:33:14 -0700
Message-ID:	<CAN0Jx--sfTdJF1pGg+e4AfrVAfXpr1NuzNeGqAgvTG6s0H44WA@mail.gmail.com>
Subject:	Re: [geda-user] keeping solder mask off thermal rectangles?
From:	Russell Dill <Russ DOT Dill AT asu DOT edu>
To:	geda-user AT delorie DOT com
Reply-To:	geda-user AT delorie DOT com
Errors-To:	nobody AT delorie DOT com
X-Mailing-List:	geda-user AT delorie DOT com
X-Unsubscribes-To:	listserv AT delorie DOT com

On Mon, Aug 26, 2013 at 11:04 AM, Britton Kerin <britton DOT kerin AT gmail DOT com> wrote:
>
> I've got a part with a thermal pad on the bottom of a SOIC package.
>
> I was able to create rectangles on the solder and component sides of the
> board, then connect them with vias, and turn the vias into thermals with
> complete connections using thermal tool and shift-click.

Pretty sure you want to *not* use thermals in this case, just a solid
connection.

> The last thing I think I want to do is keep the solder mask off the
> rectangular areas.  I think.  Or perhaps it doesn't really matter for heat
> dissipation?
>
> Anyway I haven't been able to sort out how to do this last thing.
> Suggestions?
>
> Thanks,
> Britton
>

- Raw text -