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Thu, 18 Jul 2013 11:29:55 -0700 (PDT) | |
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Date: | Thu, 18 Jul 2013 14:29:55 -0400 |
Message-ID: | <CALSZ9gqP1gbdEAR_MLSdiM_UyX_TfcCF8op8rGUNyB1pJHiRuQ@mail.gmail.com> |
Subject: | Re: [geda-user] PCB BGA (ball grid array) Package/Footprint |
From: | Rob Butts <r DOT butts2 AT gmail DOT com> |
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--bcaec548597496299204e1cd655e Content-Type: text/plain; charset=ISO-8859-1 I'm not sure exactly what you mean here, I was thinking the pads would have a small detent the IC would settle into but apparently no such luck. It would just make it easier to line up. The people I have doing my assembly have a hard time as I imagine most people do. Thanks On Thu, Jul 18, 2013 at 12:51 PM, Bob Paddock <graceindustries AT gmail DOT com>wrote: > > The other is applying a thin layer of > > flux to the area of the BGA footprint. > > Make sure there is a clear path for water flow (cleaning fluids) for > ingress and egress of the flux. > > Makes a difference in reliability of high impedance circuits and ultra > low power circuits. > > "Make it smaller" does not always go well with "make it manufacturable" > when > hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like > bypass caps for example. :-( > --bcaec548597496299204e1cd655e Content-Type: text/html; charset=ISO-8859-1 Content-Transfer-Encoding: quoted-printable <div dir=3D"ltr"><div>I'm not sure exactly what you mean here,</div><di= v>=A0</div><div>I was thinking the pads would have a small detent the IC wo= uld settle into but apparently no such luck.=A0 It would just make it easie= r to line up.=A0 The people I have doing my assembly have a hard time as I = imagine most people do.</div> <div>=A0</div><div>Thanks</div></div><div class=3D"gmail_extra"><br><br><di= v class=3D"gmail_quote">On Thu, Jul 18, 2013 at 12:51 PM, Bob Paddock <span= dir=3D"ltr"><<a href=3D"mailto:graceindustries AT gmail DOT com" target=3D"_bl= ank">graceindustries AT gmail DOT com</a>></span> wrote:<br> <blockquote class=3D"gmail_quote" style=3D"margin:0 0 0 .8ex;border-left:1p= x #ccc solid;padding-left:1ex"><div class=3D"im">> The other is applying= a thin layer of<br> > flux to the area of the BGA footprint.<br> <br> </div>Make sure there is a clear path for water flow (cleaning fluids) for<= br> ingress and egress of the flux.<br> <br> Makes a difference in reliability of high impedance circuits and ultra<br> low power circuits.<br> <br> "Make it smaller" does not always go well with "make it manu= facturable" when<br> =A0hard to clean parts (BGA/QFN/LCC/LGA) are surrounded by things like<br> bypass caps for example. :-(<br> </blockquote></div><br></div> --bcaec548597496299204e1cd655e--
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