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	Sat, 16 Feb 2013 00:49:46 -0800 (PST)
Message-ID:	<511F4826.2030407@gmail.com>
Date:	Sat, 16 Feb 2013 09:49:42 +0100
From:	onetmt <onetmt AT gmail DOT com>
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To:	geda-user AT delorie DOT com
Subject:	Re: [geda-user] Stencil opening in pcb footprint
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Reply-To:	geda-user AT delorie DOT com

Il 15/02/2013 19:32, Russell Dill ha scritto:
> On Fri, Feb 15, 2013 at 9:41 AM, Russell Dill <Russ DOT Dill AT asu DOT edu> wrote:
>> On Fri, Feb 15, 2013 at 6:23 AM, onetmt <onetmt AT gmail DOT com> wrote:
>>>
>>> A lot of "modern" ICs, mainly those featuring a thermal/power pad,
>>> require stencil openings with different sizes from their respective to
>>> pad sizes; until now I managed stencil openings by manually editing the
>>> gerber layer generated by pcb, but this solution looks quite impractical
>>> when facing some complex boards with several of this ICs on them.
>>>
>>> Is there a way to define the stencil in footprint file, just like we do
>>> for mask opening?
>>
>> Yes, use the nopaste flag for the pad itself, and then overlay it with
>> one or more smaller pads without the nopaste flag
> 
> Example:
> http://www.gedasymbols.org/user/russell_dill/footprints/S-PVQFN-N64.fp
> 

ouch, I see :)

ty for your suggestion

-- 
Hofstadter's Law:
"It always takes longer than you expect, even when you take into account
Hofstadter's Law."

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