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From: | "karl AT aspodata DOT se [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
To: | geda-user AT delorie DOT com |
Subject: | Re: [geda-user] [OT] Solder paste woes |
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Comments: | In-reply-to "Gabriel Paubert (paubert AT iram DOT es) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com> |
message dated "Wed, 17 Aug 2022 23:29:29 +0200." | |
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Gabriel Paubert: ... > Definitely, these ones need 65-70% area coverage from my experience, > anything above 80% is a disaster. And this is with QFN with quite a few > PTH for thermal dissipation on the internal layers or other side (with > solder mask removed on the other side also). ... For more info on QFN, see; www.jedec.org JEP95 MO-220K01.pdf www.jedec.org JEP95 MO-229F.pdf https://www.nxp.com/docs/en/application-note/AN1902.pdf https://www.custommmic.com/resources/custom-mmic-app-note-105.pdf ti.com scba017d.pdf ti.com sloa122.pdf cypress.com 001-72845_AN72845_Design_Guidelines_For_Cypress_Quad_Flat_No_Lead_QFN_Packaged_Devices.pdf I don't have theese but they seems related: IPC-7525 Stencil Design Guidelines IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard IPC-7093 Design and Assembly Process Implementation for Bottom Termination Components Regards, /Karl Hammar
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