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Date:	Sat, 20 Jul 2013 07:16:18 -0400
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Subject:	Re: [geda-user] PCB BGA (ball grid array) Package/Footprint
From:	Bob Paddock <bob DOT paddock AT gmail DOT com>
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Old paper on reliability of BGA solder bumps.  Has some info on testing as well:

http://www.electroiq.com/articles/ap/print/volume-11/issue-7/features/reliability-of-bga-solder-bumps.html




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