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References:	<20120323153154 DOT 31f9090d AT svelte>
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Date:	Sat, 24 Mar 2012 06:50:19 -0400
Message-ID:	<CAPYb0EFAGpee1W0qu8F65sp9CcXW52n=wAh+Ni5d9tMObXc+dQ@mail.gmail.com>
Subject:	Re: [geda-user] Solder paste/nopaste flag overlapping, and custom
	paste apertures
From:	Bob Paddock <bob DOT paddock AT gmail DOT com>
To:	geda-user AT delorie DOT com
Reply-To:	geda-user AT delorie DOT com
Errors-To:	nobody AT delorie DOT com
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> I read an article somewhere that described a modification of this
> where the QFN exposed pad is actually segmented by solder mask as
> well as the paste stencil -- this keeps the solder evenly
> distributed even if the chip tries to tilt a bit.

It is only the stencil for the paste that should be segmented, to
control the amount of the paste.
The mask and pad should not be segmented.

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