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| To: | geda-help AT delorie DOT com |
| From: | "Ian Chapman (ichapman AT videotron DOT ca) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com> |
| Subject: | [geda-help] Thermal pad |
| Message-id: | <564F4722.5080406@videotron.ca> |
| Date: | Fri, 20 Nov 2015 11:15:30 -0500 |
| User-Agent: | Mozilla/5.0 (X11; Linux x86_64; rv:38.0) Gecko/20100101 |
| Thunderbird/38.3.0 | |
| Reply-To: | geda-help AT delorie DOT com |
Hi all,
Before I run into any unnecessary difficulties in layout I'd better
ask the experts. It's a DDA package, an SO8 with a thermal pad. It was
simple to add a pin 9 as a square pad inside the pins. My question is
what is the best way to add half a dozen vias to the pad that connect
electrically and thermally to the ground plane below? Regards Ian.
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