X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha1; c=relaxed; d=sendgrid.net; h=subject:to:references:from:mime-version:in-reply-to:content-type:content-transfer-encoding; s=smtpapi; bh=27fw0Vb46dZksMXoXWb9oQ/tl3A=; b=Ii5iKwpfkuwe3IkMir 10zl4AoHea5NG4f5XO6pkGK0F61/AvWzMVkMtz4ejEPJ1JfnV0BQZ2D/RmvGzsPq 1OzX0WfFL9xJxkRyxYbKmWG/F6VnFZJgVACQAFy+HTM01uzOammJspjEAPOJD83N ctWgNblLpOt4onspLPWhUbszc= Subject: Re: [geda-user] A workflow for gEDA PCB font symbol/glyph creation To: geda-user AT delorie DOT com References: <20161213135952 DOT 3756D81075A5 AT turkos DOT aspodata DOT se> <1eea1753-da43-c43c-3f41-fc67aac496bf AT ecosensory DOT com> From: "John Griessen (john AT ecosensory DOT com) [via geda-user AT delorie DOT com]" Message-ID: <66dc8a90-0e2f-5ec1-eebf-14d01d745887@ecosensory.com> Date: Wed, 14 Dec 2016 10:24:42 -0600 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:45.0) Gecko/20100101 Icedove/45.4.0 MIME-Version: 1.0 In-Reply-To: Content-Type: text/plain; charset=utf-8; format=flowed Content-Transfer-Encoding: 7bit X-SG-EID: V53lTA/kUP1+IqXnzXuv0M/cu/N8aMtf7nxyAyKnAkulOcascBmo/K2LQH50TI2aAZD3T/gklHFqRw s33oaptdkdYd0zfcHt3PT9GHpvHx1EYYcquXfcbFExIIjXAsGWC0zcTJXT7FYyaOIZ9WiIn7x7wkpX bXnWWRd2IFu9J0lIC4dng6pGqa3KKjM0e9QbGIwFtt3gGZ1YtRzYVGgPb1MTPEPuD1oLzd//DNnHHR k= Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On 12/13/2016 06:45 PM, Erich Heinzle (a1039181 AT gmail DOT com) [via geda-user AT delorie DOT com] wrote: > I hadn't turned my mind to applications involving circuit trace > analysis, but it is an intriguing idea. Recognizing traces could enable reuse much more than is commonly easy now. One would start with scans or photographs of existing boards. GIMP could be used to "square up" a photo. Next recognize circuitry as glyphs that are compatible with traces. Then reduce the noise in the traces and pads. Then select various objects based on heuristics and make them all the same size when they should be -- kind of like "snapping to grid" but for sizes of pads, vias also. This kind of approach might even work with components still attached -- some vias might only show half their round areas, or have through hole parts covering some of them. Better yet, melt off and cut off components first. You could get a layout by associating footprints with pads. Then do push/shove routing to a grid and you've made an old circuit or new-but-not-documented breakout board reusable.