X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Date: Thu, 10 Sep 2015 22:14:16 +0200 From: Jan Kasprzak To: geda-user AT delorie DOT com Subject: [geda-user] 5630 LED footprint Message-ID: <20150910201416.GG16766@fi.muni.cz> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline X-Clacks-Overhead: GNU Terry Pratchett User-Agent: Mutt/1.5.20 (2009-12-10) X-Muni-Envelope-From: kas AT fi DOT muni DOT cz X-Muni-Spam-TestIP: 147.251.48.3 X-Muni-Local-IP: yes X-Greylist: Sender IP whitelisted, not delayed by milter-greylist-4.3.9 (minas.ics.muni.cz [147.251.4.35]); Thu, 10 Sep 2015 22:14:17 +0200 (CEST) X-Virus-Scanned: clamav-milter 0.98.7 at minas X-Virus-Status: Clean Reply-To: geda-user AT delorie DOT com Hello, did anybody try to design a footprint for a 5630 SMD LED? The recommended design for the Lumileds one is here on page 7: http://www.lumileds.com/uploads/351/DS201-pdf In addition to that, I would like to modify the footprint for hand soldering, i.e. the middle thermal pad should have a hole in it, connected to a large pad on the opposite side of the PCB. The hole and the pad would then serve as a heat sink. What is the best way to do it? Thanks! -Yenya -- | Jan "Yenya" Kasprzak | | New GPG 4096R/A45477D5 -- see http://www.fi.muni.cz/~kas/pgp-rollover.txt | | http://www.fi.muni.cz/~kas/ Journal: http://www.fi.muni.cz/~kas/blog/ | Smart data structures and dumb code works a lot better than the other way around. --Eric S. Raymond