X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Authentication-Warning: envy.delorie.com: dj set sender to dj AT delorie DOT com using -f From: DJ Delorie To: geda-user AT delorie DOT com Subject: Re: [geda-user] Thermals: size problem, SMD In-Reply-To: <9f527cf8-d7c0-2b6a-641f-23efb3663ff2@linetec.nl> (geda-user@delorie.com) Date: Thu, 12 Jul 2018 16:36:25 -0400 Message-ID: MIME-Version: 1.0 Content-Type: text/plain Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk "Richard Rasker (rasker AT linetec DOT nl) [via geda-user AT delorie DOT com]" writes: > 1: When I create small vias with a thermal, e.g. 0.3 mm drill width, > 0.15 mm annulus width and 0.15 mm clearing, the resulting four thermal > connections to the surrounding copper plane get so narrow (just below > 0.125 mm), that my PCB manufacturer flags a warning. The Thermal[] entry in your *.pcb sets the thermal ratio; the default is 0.5. http://pcb.geda-project.org/pcb-4.1.2/pcb.html#Thermal-syntax > 2: SMD thermals, or the lack thereof. If I really need thermals, I > create tiny rectangles without clearance (S key) to connect pads to the > surrounding copper planes. Lack thereof. Technically possible, but difficult to guess what kinds of thermals work for the wide range of SMD pad shapes and groupings.