X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=googlemail.com; s=20120113; h=mime-version:in-reply-to:references:date:message-id:subject:from:to :content-type; bh=KAIKSM7ElIOPCBCPVuGg8o2g8FMvIzaH6H0RhXO17bA=; b=INa638XRk8E0jzh/8BzF4Qv7w1Uz9IvXKoCp0CrEg3RV3xc2liTLYfnTuxIUwUhV4O 8FZ41IH9+jyPgGBsNQCnFlRl039Ot8QLABIRFwx7R1qLOZNMqWIPSWHUUosNrGsZU1Kz B8m8r4fu6KFbOpO19HcB2u0cNSEJFQS3GmORyEjwZ9r/zMa8l9Ar6stXhePbv/DyDWr4 a5NeaoMIrPhj5rou7vCGIzNCrXlq2lQMk/kJI63WV4liO+qyL4VlYIXcP0j3ZT07rk9I xtZ9WB61PIf/rj2TUoab1urUM45P2YxHXY51ir5WOhKQyov3LJN0xw/DB6SlsLiRiVJT pVRg== MIME-Version: 1.0 X-Received: by 10.182.120.4 with SMTP id ky4mr12325073obb.16.1450831255893; Tue, 22 Dec 2015 16:40:55 -0800 (PST) In-Reply-To: References: <20151221030451 DOT 02399163eb3e40f21c622c41 AT gmail DOT com> <20151221203331 DOT 20837 DOT qmail AT stuge DOT se> <20151222002012 DOT a88d7fe32a9336855eccd1d0 AT gmail DOT com> <201512220412 DOT tBM4CJxb018546 AT envy DOT delorie DOT com> Date: Wed, 23 Dec 2015 00:40:55 +0000 Message-ID: Subject: Re: [geda-user] Proposing a New Hierarchical Data Structure? From: "Peter Clifton (petercjclifton AT googlemail DOT com) [via geda-user AT delorie DOT com]" To: gEDA User Mailing List Content-Type: text/plain; charset=UTF-8 Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk >> STEP is the easy bit - (compared to the 3D kernel stuff). That is not >> understate how much of a pain STEP can be! - I'm just not sure it is >> possible to _overstate_ how nasty 3D kernels are. FWIW, I never proposed to write one (even if a part of me wishes I had the brain-power to do so!) > Agreed. All the talk of casually turning pcb into a 3D app kind of shocks > me. 3D visualisation is easy, and is not something we should be scared of. 3D viz inside PCB tools is the norm now, not the exception. (NB: Not just commercial, KiCAD has a fairly decent 3D view) 3D CAD is a monster - and not in scope with what I'm suggesting. Leave that for the 3D CAD packages - but we ought to be able to export stuff that feeds them. >> >> (Look at all the problems we have getting polygon boolean algebra >> right... with two linear, 2D primitives... extend to 3D, with arcs, >> lines, parametric-curves, splines, .... potentially in 3D spaces, not >> just planar - and you start to get a small hint of the scale of the >> engineering and mathematical problem). > > > Yep. Considering that pcb covers most needs now, going 3D to get the last > few seems like a really questionable decision compared to making specific > inter-layer extensions to handle them. If you didn't catch my talk from last year's FOSDEM, that covers pretty much all the motivations why a certain amount of 3D export capability is really useful in many engineering settings We don't need a lot extra in terms of information to do a decent job of exporting the board in 3D (including pulling in components). Peter