X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:date:message-id:subject:from:to:content-type; bh=artJJf9OognZVlXsTGHE4Qo+vJwlsisZSjg70uiIjDQ=; b=tJYMLpjxokvCxy6tumxpv7OAaxfRl1vxLDO8q75FXXrMBGDhn7a+86ibdqIkJSHQ8N QSCRSGO0oeVMP5gCtPtoEU/lO2qnJybJl20iZSZl8n7SB9UMv8IQGp6fPwPCFXhzboam uaAMEzTJA7cGPNTktjWB4UqriNwaf2hmMHao/DsiM2FIWH4amLJmxOiKMNVwGRlfUy9w H3gpxm/DyalYMZgju1IBdfMRjPF0mSe55Nrc9X9CiOskl6/jaqDddzDZ8Z8C01H642ux cKH+4WKf85LGNXK/QYoMnIYWKbuhHq3O1sO6eGdwEP/OZu5DZVN7ujRVWzRFSLPt3vzh Tz/w== MIME-Version: 1.0 X-Received: by 10.182.148.98 with SMTP id tr2mr6902916obb.28.1422715225692; Sat, 31 Jan 2015 06:40:25 -0800 (PST) Date: Sat, 31 Jan 2015 09:40:25 -0500 Message-ID: Subject: [geda-user] Re: Ground Plane Behavior? From: Jason White To: geda-user AT delorie DOT com Content-Type: text/plain; charset=UTF-8 Reply-To: geda-user AT delorie DOT com Taken from the thread "(no subject)" On Sat, Jan 31, 2015 at 4:20 AM, Bernhard Kraft wrote: > > > > This would be the correct phrase: I boxed out the ground plane. > > So there is no way of getting it to flood the boxed out areas again? > > When I place a via into a poly it gets isolated at first. I have to add > thermals to the via. This is quite unusal as plated vias don't need > thermals. > > When I put the via into a normal track it doesn't get isolated. I know I can > use the shift key when placing the thermal to alter its style and the last > thermal variant is simply a full connect ... > > > I know PCB is quite old and there are a lot of issues. I just wanted to know > if this behaviour: "Outboxed planes don't flood again if re-connected" is > documented as bug? > > I am also willing to invest some time in bug hunting and maybe provide > patches ... Well, that is an interesting idea. To clarify, the behavior you are proposing is: 1. An existing copper pour gets "boxed out" so that their is a "hole" where the plane no longer extends due to traces on the PCB. 2. Placing a via in the "hole" and electrically connecting it to the "boxed out" copper pour would result in the hole being refilled with copper. That might be convenient, but I think it could be a bit of a "trap" so to speak. If you have large currents flowing from the re-flooded "hole" in the copper pour, you may not realize that their is an electrically poor connection (a single via) to the actual plane. If this behavior was added, I would think that this behavior should be explicitly called up with a tool or menu item in PCB as opposed to being an automatic behavior. Does anyone else have any input on Bernhard's idea? -- Jason White