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Date: Mon, 29 May 2017 05:08:39 +0200 (CEST)
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To: "Peter Stuge (peter AT stuge DOT se) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
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Subject: Re: [geda-help] Thank you verry much, next Idea - IPC proof
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On Mon, 29 May 2017, Peter Stuge (peter AT stuge DOT se) [via geda-help AT delorie DOT com] wrote:

> Smilie (smilie AT posteo DOT de) [via geda-help AT delorie DOT com] wrote:
>> We can add some SMD-Footprints to the standard library  in accordance
>> to the IPC.
> ..
>> And more Easy is the including of some standard footprints "IPC0603",
>> "IPC0805","IPC2220"....
>>
>> What you think about.
>
> Footprints are an interesting topic. The thing is, many people want
> to make small variations on standardized footprints, myself included.
>
> There are different reasons to do so, one is to simplify hand
> assembly, another is to adjust for board fab parameters.

That's just a set of optional parameters in the parametric footprint 
model; the stock parametrics for pcb-rnd supports that for most 
footprints. For example in a so() footprint the main parameters 
are the number of pins and row spacing, but a lot of detailed parameters 
are optionally accessible, like pad_thickness=xx, pad_clearance=xx.

> I think a new data model for (among other things) footprints which
> includes such parameters would be useful, and I would love to spend
> a month or two working on that, but I'm not able to do so at the
> moment. :\

Slightly related: we did a feature request poll among active pcb-rnd users 
a few months ago. The most popular features, the winners were: ediatable 
mask/paste layers and new footprint model. (We are going to release the 
implementation for the former in a few days.) I've already allocated a 
month of pure coding for the new footprint model. Will announce details 
soon, on geda-user@.

Regards,

Igor2